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    发布时间:2017-02-15 14:47:36    点击:1194

法国斯特拉斯堡大学Nicolas Giuseppone教授报告会


题  目:Triarylamines-based Supramolecular Polymers:Structures, Dynamics, Functions
报告人:Nicolas Giuseppone, University of Strasbourg, Institut Universitaire de France (IUF),
地  点:化学楼 G204
时  间:2017年2月17(周五)上午10:30
联系人:王乐勇教授,强琚莉 副教授
E-mail: giuseppone@unistra.fr
Website: http://sams.ics-cnrs.unistra.fr/en
Lecture abstract:  
   Supramolecular organic electronics rests on the use of bottom-up chemical self-assembly processes in order to design conducting components at the 5–100 nm scale. Challenges in this field are both the construction of 1D-nanostructures displaying optimized transport properties and their precise connections to electrodes. By externally controlling light-responsive supramolecular polymerization processes of tailored triarylamine molecules, and by using appropriate methods of orientation, we have now demonstrated that it becomes possible to pre-determine the accurate positioning of organic interconnects within patterned nano-circuitry.Along this main line, we will describe the detailed mechanism of this very original self-assembly process. We will show that supramolecular polymerization can be extended to a number of advanced triarylamine derivatives for the production of various nanostructures.We will also discuss the optical and electronic properties of these supramolecular polymers which reveal optical, magnetic, and electronic metallic signatures; the nature of their through-space conduction will be described. Furthermore, the supramolecular dynamics of these assemblies allows for the creation of novel soft materials not accessible with conducting conjugated polymers. In particular, we will show that some triarylamine-based nanofibers demonstrate a mechanism of defect repair driven by polaron diffusion through their supramolecular stacks.We will finally highlight how the presence of such metallic electrons in these organic materials can be used for the first time in the formation of supramolecular plasmonic waveguides and interconnects.

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